Industry speculation was high that Huawei would equip the MateBook Fold with SMIC’s advanced 5nm-equivalent N+3 process chip — a move that, according to TechInsights, would represent Huawei’s most ambitious push into full-stack computing, encompassing chip design, OS development, and hardware integration.
Huawei’s New Foldable Laptop Uses Older SMIC Chip as U.S. Curbs Stall Semiconductor Progress: Report
Huawei’s new MateBook Fold laptop is powered by an older-generation chip from China’s top foundry SMIC, underscoring how U.S. export restrictions continue to impede China’s progress in advanced semiconductor manufacturing, according to Canadian research firm TechInsights.
Industry observers had anticipated that the MateBook Fold would feature SMIC’s more advanced 5nm-class N+3 chip. The device marks what TechInsights calls Huawei’s “most aggressive move into full-stack computing,” encompassing chip design, operating system development, and hardware integration.
However, the laptop instead uses the Kirin X90 chip, built on SMIC’s 7nm N+2 process node — the same node first seen in August 2023. This indicates that SMIC may not yet be able to mass-produce 5nm-equivalent chips, TechInsights said.
“U.S.-imposed technology restrictions are likely still limiting SMIC’s ability to close the gap with global foundry leaders, especially in chips for mobile, PC, and AI/cloud markets,” the report added.
The MateBook Fold, which lacks a physical keyboard and features an 18-inch OLED dual-screen display, is one of two laptops Huawei unveiled last month. These devices represent the company’s broader effort to establish a self-reliant tech ecosystem amid continued U.S. efforts to restrict its access to advanced chips.
The new laptops also debut Huawei’s HarmonyOS for PCs. While Huawei has not officially disclosed the processor used, previous models relied on Intel chips. The company did not respond to requests for comment.
Reuters previously reported that the U.S. had revoked licenses that allowed Intel and Qualcomm to supply Huawei with chips for laptops and smartphones. As a result, SMIC has limited access to advanced tools like extreme ultraviolet (EUV) lithography, forcing reliance on older and less efficient multi-patterning methods that reduce chip yields.
TechInsights noted that Huawei’s 7nm chip lags several generations behind offerings from Apple, Qualcomm, and AMD. It estimates that China remains at least three generations behind the global semiconductor leaders, with companies like TSMC and Intel preparing to introduce 2nm process nodes in the next year or two.
Despite this, Huawei founder Ren Zhengfei recently told Chinese state media that the company’s chips are only one generation behind U.S. peers and that it is working to boost performance through innovations such as cluster computing.